Ten Common problems in PCB Design

PCBgogo Electronic Project Engineer's Best Partner！ Online Gerber Viewer Mobile Website Contact Us Email: [email protected] Teams WEB 24 hours a day, 7 days a week. Quick Contact English English 日本語 한국어 Cart Sign in \ Register Hi! New Customer? Register Sign in • My Account • My Orders list • Account Balance • Discount coupon • Reward points • My Delivery Address • My Forum • Message Sign Out

PCBgogo Electronic Project Engineer's Best Partner！

Online Gerber Viewer Mobile Website Contact Us Email: [email protected] Teams WEB 24 hours a day, 7 days a week. Quick Contact English English 日本語 한국어 Cart Sign in \ Register Hi! New Customer? Register Sign in • My Account • My Orders list • Account Balance • Discount coupon • Reward points • My Delivery Address • My Forum • Message Sign Out

Email: [email protected] Teams WEB 24 hours a day, 7 days a week. Quick Contact

Teams WEB 24 hours a day, 7 days a week. Quick Contact

24 hours a day, 7 days a week.

English English 日本語 한국어 Cart Sign in \ Register Hi! New Customer? Register Sign in • My Account • My Orders list • Account Balance • Discount coupon • Reward points • My Delivery Address • My Forum • Message Sign Out

Sign in \ Register Hi! New Customer? Register Sign in • My Account • My Orders list • Account Balance • Discount coupon • Reward points • My Delivery Address • My Forum • Message Sign Out

New Customer? Register Sign in • My Account • My Orders list • Account Balance • Discount coupon • Reward points • My Delivery Address • My Forum • Message Sign Out

New Customer? Register Sign in

• My Account • My Orders list • Account Balance • Discount coupon • Reward points • My Delivery Address • My Forum • Message Sign Out

Home PCB Instant Quote PCB Manufacturing Calculator PCB Assembly Calculator Flexible PCB/ Rigid-Flex PCB Calculator SMD Stencil Calculator Advanced PCB CNC Machining CNC Machining Service CNC Milling CNC Turning CNC Quote Flex / Rigid-Flex PCB PCB Assembly Files Requested for PCBA PCBA Special Reminders Panel Requirements for PCBA Components Sourcing Capabilities PCB Capabilities Standard PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-flex PCB Capabilities PCBA Capabilities PCBA Capabilities PCB Assembly Process PCBA Special Reminders Fast Turnkey PCB Assembly Files Requested for PCBA SMD Stencil Quality Assurance Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Electric Test (E-test) Impedance control RoHS-lead Free PCBs UL Certification PCB Laminate Materials Blog Knowledge Center Printed Circuit Board Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly Laser Stencil Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up PCB price composition The factors that affect the PCB price PCB Layout PCB Design and Layout Forum More content Feedback About Us Help center Contact Us About Us News Why Buy From us Contact Us Order Guide Method of payment Shipping method guide Return policy Promotions PCB & PCBA 11th Anniversary Sale CNC Machining 11th Anniversary Sale HDI PCB 11th Anniversary Sale

PCB Instant Quote PCB Manufacturing Calculator PCB Assembly Calculator Flexible PCB/ Rigid-Flex PCB Calculator SMD Stencil Calculator

PCB Manufacturing Calculator PCB Assembly Calculator Flexible PCB/ Rigid-Flex PCB Calculator SMD Stencil Calculator

Flexible PCB/ Rigid-Flex PCB Calculator

CNC Machining CNC Machining Service CNC Milling CNC Turning CNC Quote

CNC Machining Service CNC Milling CNC Turning CNC Quote

PCB Assembly Files Requested for PCBA PCBA Special Reminders Panel Requirements for PCBA

Files Requested for PCBA PCBA Special Reminders Panel Requirements for PCBA

Capabilities PCB Capabilities Standard PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-flex PCB Capabilities PCBA Capabilities PCBA Capabilities PCB Assembly Process PCBA Special Reminders Fast Turnkey PCB Assembly Files Requested for PCBA SMD Stencil Quality Assurance Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Electric Test (E-test) Impedance control RoHS-lead Free PCBs UL Certification PCB Laminate Materials Blog Knowledge Center Printed Circuit Board Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly Laser Stencil Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up PCB price composition The factors that affect the PCB price PCB Layout PCB Design and Layout Forum More content Feedback About Us Help center Contact Us About Us News Why Buy From us Contact Us Order Guide Method of payment Shipping method guide Return policy Promotions PCB & PCBA 11th Anniversary Sale CNC Machining 11th Anniversary Sale HDI PCB 11th Anniversary Sale

PCB Capabilities Standard PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-flex PCB Capabilities PCBA Capabilities PCBA Capabilities PCB Assembly Process PCBA Special Reminders Fast Turnkey PCB Assembly Files Requested for PCBA SMD Stencil Quality Assurance Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Electric Test (E-test) Impedance control RoHS-lead Free PCBs UL Certification PCB Laminate Materials Blog Knowledge Center Printed Circuit Board Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly Laser Stencil Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up PCB price composition The factors that affect the PCB price PCB Layout PCB Design and Layout Forum More content Feedback About Us Help center Contact Us About Us News Why Buy From us Contact Us Order Guide Method of payment Shipping method guide Return policy Promotions PCB & PCBA 11th Anniversary Sale CNC Machining 11th Anniversary Sale HDI PCB 11th Anniversary Sale

PCB Capabilities Standard PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-flex PCB Capabilities

Standard PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-flex PCB Capabilities

PCBA Capabilities PCBA Capabilities PCB Assembly Process PCBA Special Reminders Fast Turnkey PCB Assembly Files Requested for PCBA SMD Stencil

PCBA Capabilities PCB Assembly Process PCBA Special Reminders Fast Turnkey PCB Assembly Files Requested for PCBA SMD Stencil

Quality Assurance Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Electric Test (E-test) Impedance control RoHS-lead Free PCBs UL Certification PCB Laminate Materials

Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Electric Test (E-test) Impedance control RoHS-lead Free PCBs UL Certification PCB Laminate Materials

Automated Optical Inspection (AOI)

Automated X-ray inspection (AXI)

Blog Knowledge Center Printed Circuit Board Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly Laser Stencil Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up PCB price composition The factors that affect the PCB price PCB Layout PCB Design and Layout Forum

Knowledge Center Printed Circuit Board Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly Laser Stencil Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up PCB price composition The factors that affect the PCB price PCB Layout PCB Design and Layout Forum

Printed Circuit Board Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly Laser Stencil Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up PCB price composition The factors that affect the PCB price PCB Layout PCB Design and Layout

Printed Circuit Board Prototype Aluminum Printed Circuit Board Rigid-flex PCBs Flexible PCBs High-frequency PCBs High-TG PCBs Thick-copper PCBs HDI PCBs LED PCBs Medical PCB Metal core PCBs Printed circuit board materials

Printed Circuit Board Prototype

Aluminum Printed Circuit Board

Printed circuit board materials

PCB Assembly Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly

Printed Circuit Board Assembly Overview SMT Assembly Capabilities Mixed Assembly Advantages BGA BGA Assembly Capabilities Through-hole Assembly Components Sourcing Panel Requirements for PCB Assembly

Printed Circuit Board Assembly Overview

Panel Requirements for PCB Assembly

Quality Assurance Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials

Automated Optical Inspection (AOI) Electrical Test (E-test) Automated X-ray Inspection (AXI) Impedance control RoHS-lead Free UL Certification PCB Laminate Materials

PCB Manufacturing PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up

PCB design & layout Layer orientation Panel creation Gold fingers Surface finish Via covering Silkscreen Blind & buried vias Annular rings Edge plating Plated Half-holes Plated-through slots Via-in-pad Milling V-scoring Backdrill layer stack-up

PCB price composition The factors that affect the PCB price

The factors that affect the PCB price

PCB Layout PCB Design and Layout

More content Feedback About Us Help center Contact Us

Feedback About Us Help center Contact Us

About Us News Why Buy From us Contact Us Order Guide Method of payment Shipping method guide Return policy

News Why Buy From us Contact Us Order Guide Method of payment Shipping method guide Return policy

Promotions PCB & PCBA 11th Anniversary Sale CNC Machining 11th Anniversary Sale HDI PCB 11th Anniversary Sale

PCB & PCBA 11th Anniversary Sale CNC Machining 11th Anniversary Sale HDI PCB 11th Anniversary Sale

PCB & PCBA 11th Anniversary Sale

CNC Machining 11th Anniversary Sale

Forum Articles Ten Common problems in PCB Design J****mes Ten Common problems in PCB Design 6538 25 Oct 18.2018, 17:35:19 0 Return PCB PCBGOGO I. overlap of pads. 1. The overlap of the pads (except the pads on the surface) means that the overlap of the holes in the drilling process will cause the drill bit to break because of drilling many times in one place, resulting in the damage of the holes. 2, two holes overlap in the multilayer board, such as one hole position is the isolation disk, the other hole position is the connection disc (the flower soldering pad), after drawing the negative in this way, it appears as the isolation disk, which causes the scrap. II. Abuse of graphics. 1, in some graphics layer to do some useless line, was originally a four-layer board but designed more than five layers of lines, so that cause misunderstanding. 2. It is easy to design. Take Protel software as an example, Board layer is used to draw the line of every layer, and Board layer is used to mark the line. In this way, when the light drawing data is carried out, because the Board layer is not selected, the line is missed and the circuit is broken. Or it may be short-circuited by selecting the marking lines for the Board layer, so the graphic layer is designed to be complete and clear. 3. Disobeying the conventional design, such as component surface design in Bottom layer, welding surface design in Top, cause inconvenience. III. Misplacing of characters. 1. The character cap pad SMD solder piece brings inconvenience to the on-off test of PCB and the welding of components. 2, the character design is too small, resulting in the difficulties of screen printing, too large overlapping characters, it is difficult to distinguish. Setting of single side Pad Aperture. 1. One-sided pads are usually not drilled. If the holes need to be marked, their aperture should be designed to be zero. If a number is designed, then the coordinates of the hole appear at this location when the borehole data is generated, and there is a problem. 2. Single-sided pads should be marked with special marks if the holes are drilled. V. draw pads with padding blocks. The pads drawn with pads can pass the DRC inspection when the circuit is designed, but can not be used for machining, because such pads can not directly generate the solder resistance data, and when the flux is applied, the filler area will be covered by the flux. It is difficult to weld and assemble the device. 6. The electric strata are both flowered pads and wired lines. Because the power source is designed in the form of solder pads, the layer is the opposite of the actual image on the printed board, and all connections are isolating lines, which the designer should be well aware of. By the way, care should be taken when drawing several sets of power sources or isolation lines for several types of ground, not to leave a gap, short circuit two sets of power sources, or block the area of the connection (so that one set of power sources is separated). 7. The definition of processing level is not clear. 1. The single side board design is in the TOP layer, if does not add the explanation positive and negative to do, perhaps makes the board to install the device but not to be able to weld. 2, for example, a four-layer board design using TOPmid1, mid2 bottom four-layer, but processing is not placed in this order, which requires explanation. There are too many padding blocks in the design or the padding blocks are filled with very thin lines. 1. The light painting data is lost, and the light painting data is not complete. 2. Because the fill block is drawn by a line in the light painting data processing, so the amount of light painting data is quite large, which increases the difficulty of data processing. The pad of the surface mount device is too short. This is for on-off testing. For too dense a surface mount device, the spacing between the two pins is fairly small and the pads are very thin. The pin must be installed in a staggered position (left and right), such as the pad design is too short. Although does not affect the device installment, but can cause the test needle not to open incorrectly. X. the spacing of large area grids is too small. The edge of the grid line is too small (less than 0.3mm). In the process of PCB manufacturing, there are many broken film attached to the board after the image is displayed, which leads to the broken line in the PCB manufacturing process. The result of the paper is as follows: (1) the edge of the grid line is too small (less than the edge of the line). I am not a Original creator. I copy it from this company PCBGOGO who is the best PCB prototye in china. This is not a spam，just a share. So pls save it , it is helpful the PCB beginers J****mes 8 Article 22 Ask and Answer 0 Comment and share Follow Articles Ｑ＆A cnc Share the Project Hot Label pcb fabrication electronic engineer PCB PCB design PCB assembly

Forum Articles Ten Common problems in PCB Design

J****mes Ten Common problems in PCB Design 6538 25 Oct 18.2018, 17:35:19

0 Return PCB PCBGOGO I. overlap of pads. 1. The overlap of the pads (except the pads on the surface) means that the overlap of the holes in the drilling process will cause the drill bit to break because of drilling many times in one place, resulting in the damage of the holes. 2, two holes overlap in the multilayer board, such as one hole position is the isolation disk, the other hole position is the connection disc (the flower soldering pad), after drawing the negative in this way, it appears as the isolation disk, which causes the scrap. II. Abuse of graphics. 1, in some graphics layer to do some useless line, was originally a four-layer board but designed more than five layers of lines, so that cause misunderstanding. 2. It is easy to design. Take Protel software as an example, Board layer is used to draw the line of every layer, and Board layer is used to mark the line. In this way, when the light drawing data is carried out, because the Board layer is not selected, the line is missed and the circuit is broken. Or it may be short-circuited by selecting the marking lines for the Board layer, so the graphic layer is designed to be complete and clear. 3. Disobeying the conventional design, such as component surface design in Bottom layer, welding surface design in Top, cause inconvenience. III. Misplacing of characters. 1. The character cap pad SMD solder piece brings inconvenience to the on-off test of PCB and the welding of components. 2, the character design is too small, resulting in the difficulties of screen printing, too large overlapping characters, it is difficult to distinguish. Setting of single side Pad Aperture. 1. One-sided pads are usually not drilled. If the holes need to be marked, their aperture should be designed to be zero. If a number is designed, then the coordinates of the hole appear at this location when the borehole data is generated, and there is a problem. 2. Single-sided pads should be marked with special marks if the holes are drilled. V. draw pads with padding blocks. The pads drawn with pads can pass the DRC inspection when the circuit is designed, but can not be used for machining, because such pads can not directly generate the solder resistance data, and when the flux is applied, the filler area will be covered by the flux. It is difficult to weld and assemble the device. 6. The electric strata are both flowered pads and wired lines. Because the power source is designed in the form of solder pads, the layer is the opposite of the actual image on the printed board, and all connections are isolating lines, which the designer should be well aware of. By the way, care should be taken when drawing several sets of power sources or isolation lines for several types of ground, not to leave a gap, short circuit two sets of power sources, or block the area of the connection (so that one set of power sources is separated). 7. The definition of processing level is not clear. 1. The single side board design is in the TOP layer, if does not add the explanation positive and negative to do, perhaps makes the board to install the device but not to be able to weld. 2, for example, a four-layer board design using TOPmid1, mid2 bottom four-layer, but processing is not placed in this order, which requires explanation. There are too many padding blocks in the design or the padding blocks are filled with very thin lines. 1. The light painting data is lost, and the light painting data is not complete. 2. Because the fill block is drawn by a line in the light painting data processing, so the amount of light painting data is quite large, which increases the difficulty of data processing. The pad of the surface mount device is too short. This is for on-off testing. For too dense a surface mount device, the spacing between the two pins is fairly small and the pads are very thin. The pin must be installed in a staggered position (left and right), such as the pad design is too short. Although does not affect the device installment, but can cause the test needle not to open incorrectly. X. the spacing of large area grids is too small. The edge of the grid line is too small (less than 0.3mm). In the process of PCB manufacturing, there are many broken film attached to the board after the image is displayed, which leads to the broken line in the PCB manufacturing process. The result of the paper is as follows: (1) the edge of the grid line is too small (less than the edge of the line). I am not a Original creator. I copy it from this company PCBGOGO who is the best PCB prototye in china. This is not a spam，just a share. So pls save it , it is helpful the PCB beginers

PCB PCBGOGO I. overlap of pads. 1. The overlap of the pads (except the pads on the surface) means that the overlap of the holes in the drilling process will cause the drill bit to break because of drilling many times in one place, resulting in the damage of the holes. 2, two holes overlap in the multilayer board, such as one hole position is the isolation disk, the other hole position is the connection disc (the flower soldering pad), after drawing the negative in this way, it appears as the isolation disk, which causes the scrap. II. Abuse of graphics. 1, in some graphics layer to do some useless line, was originally a four-layer board but designed more than five layers of lines, so that cause misunderstanding. 2. It is easy to design. Take Protel software as an example, Board layer is used to draw the line of every layer, and Board layer is used to mark the line. In this way, when the light drawing data is carried out, because the Board layer is not selected, the line is missed and the circuit is broken. Or it may be short-circuited by selecting the marking lines for the Board layer, so the graphic layer is designed to be complete and clear. 3. Disobeying the conventional design, such as component surface design in Bottom layer, welding surface design in Top, cause inconvenience. III. Misplacing of characters. 1. The character cap pad SMD solder piece brings inconvenience to the on-off test of PCB and the welding of components. 2, the character design is too small, resulting in the difficulties of screen printing, too large overlapping characters, it is difficult to distinguish. Setting of single side Pad Aperture. 1. One-sided pads are usually not drilled. If the holes need to be marked, their aperture should be designed to be zero. If a number is designed, then the coordinates of the hole appear at this location when the borehole data is generated, and there is a problem. 2. Single-sided pads should be marked with special marks if the holes are drilled. V. draw pads with padding blocks. The pads drawn with pads can pass the DRC inspection when the circuit is designed, but can not be used for machining, because such pads can not directly generate the solder resistance data, and when the flux is applied, the filler area will be covered by the flux. It is difficult to weld and assemble the device. 6. The electric strata are both flowered pads and wired lines. Because the power source is designed in the form of solder pads, the layer is the opposite of the actual image on the printed board, and all connections are isolating lines, which the designer should be well aware of. By the way, care should be taken when drawing several sets of power sources or isolation lines for several types of ground, not to leave a gap, short circuit two sets of power sources, or block the area of the connection (so that one set of power sources is separated). 7. The definition of processing level is not clear. 1. The single side board design is in the TOP layer, if does not add the explanation positive and negative to do, perhaps makes the board to install the device but not to be able to weld. 2, for example, a four-layer board design using TOPmid1, mid2 bottom four-layer, but processing is not placed in this order, which requires explanation. There are too many padding blocks in the design or the padding blocks are filled with very thin lines. 1. The light painting data is lost, and the light painting data is not complete. 2. Because the fill block is drawn by a line in the light painting data processing, so the amount of light painting data is quite large, which increases the difficulty of data processing. The pad of the surface mount device is too short. This is for on-off testing. For too dense a surface mount device, the spacing between the two pins is fairly small and the pads are very thin. The pin must be installed in a staggered position (left and right), such as the pad design is too short. Although does not affect the device installment, but can cause the test needle not to open incorrectly. X. the spacing of large area grids is too small. The edge of the grid line is too small (less than 0.3mm). In the process of PCB manufacturing, there are many broken film attached to the board after the image is displayed, which leads to the broken line in the PCB manufacturing process. The result of the paper is as follows: (1) the edge of the grid line is too small (less than the edge of the line). I am not a Original creator. I copy it from this company PCBGOGO who is the best PCB prototye in china. This is not a spam，just a share. So pls save it , it is helpful the PCB beginers

I. overlap of pads. 1. The overlap of the pads (except the pads on the surface) means that the overlap of the holes in the drilling process will cause the drill bit to break because of drilling many times in one place, resulting in the damage of the holes. 2, two holes overlap in the multilayer board, such as one hole position is the isolation disk, the other hole position is the connection disc (the flower soldering pad), after drawing the negative in this way, it appears as the isolation disk, which causes the scrap. II. Abuse of graphics. 1, in some graphics layer to do some useless line, was originally a four-layer board but designed more than five layers of lines, so that cause misunderstanding. 2. It is easy to design. Take Protel software as an example, Board layer is used to draw the line of every layer, and Board layer is used to mark the line. In this way, when the light drawing data is carried out, because the Board layer is not selected, the line is missed and the circuit is broken. Or it may be short-circuited by selecting the marking lines for the Board layer, so the graphic layer is designed to be complete and clear. 3. Disobeying the conventional design, such as component surface design in Bottom layer, welding surface design in Top, cause inconvenience. III. Misplacing of characters. 1. The character cap pad SMD solder piece brings inconvenience to the on-off test of PCB and the welding of components. 2, the character design is too small, resulting in the difficulties of screen printing, too large overlapping characters, it is difficult to distinguish. Setting of single side Pad Aperture. 1. One-sided pads are usually not drilled. If the holes need to be marked, their aperture should be designed to be zero. If a number is designed, then the coordinates of the hole appear at this location when the borehole data is generated, and there is a problem. 2. Single-sided pads should be marked with special marks if the holes are drilled. V. draw pads with padding blocks. The pads drawn with pads can pass the DRC inspection when the circuit is designed, but can not be used for machining, because such pads can not directly generate the solder resistance data, and when the flux is applied, the filler area will be covered by the flux. It is difficult to weld and assemble the device. 6. The electric strata are both flowered pads and wired lines. Because the power source is designed in the form of solder pads, the layer is the opposite of the actual image on the printed board, and all connections are isolating lines, which the designer should be well aware of. By the way, care should be taken when drawing several sets of power sources or isolation lines for several types of ground, not to leave a gap, short circuit two sets of power sources, or block the area of the connection (so that one set of power sources is separated). 7. The definition of processing level is not clear. 1. The single side board design is in the TOP layer, if does not add the explanation positive and negative to do, perhaps makes the board to install the device but not to be able to weld. 2, for example, a four-layer board design using TOPmid1, mid2 bottom four-layer, but processing is not placed in this order, which requires explanation. There are too many padding blocks in the design or the padding blocks are filled with very thin lines. 1. The light painting data is lost, and the light painting data is not complete. 2. Because the fill block is drawn by a line in the light painting data processing, so the amount of light painting data is quite large, which increases the difficulty of data processing. The pad of the surface mount device is too short. This is for on-off testing. For too dense a surface mount device, the spacing between the two pins is fairly small and the pads are very thin. The pin must be installed in a staggered position (left and right), such as the pad design is too short. Although does not affect the device installment, but can cause the test needle not to open incorrectly. X. the spacing of large area grids is too small. The edge of the grid line is too small (less than 0.3mm). In the process of PCB manufacturing, there are many broken film attached to the board after the image is displayed, which leads to the broken line in the PCB manufacturing process. The result of the paper is as follows: (1) the edge of the grid line is too small (less than the edge of the line). I am not a Original creator. I copy it from this company PCBGOGO who is the best PCB prototye in china. This is not a spam，just a share. So pls save it , it is helpful the PCB beginers

J****mes 8 Article 22 Ask and Answer 0 Comment and share Follow

Articles Ｑ＆A cnc Share the Project Hot Label pcb fabrication electronic engineer PCB PCB design PCB assembly

Hot Label pcb fabrication electronic engineer PCB PCB design PCB assembly

pcb fabrication electronic engineer PCB PCB design PCB assembly

QUICK CONTACT Please leave your message below and one of our helpful staff will contact you within 48 hours. Whatsapp： +8618665922549 Email: [email protected] Tel: +86 - (0) 755-2330-0601 CAPABILITIES PCBA Capabilities FR-4 PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-Flex PCB Capabilities ABOUT PCBGOGO Introduction Why Buy From us Order Guide Method of Payment Shipping Methods Guide News Privacy Policy Terms of Service OTHERS RoHS-lead Free PCBs Online Gerber View Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Quality guarantee Electric Test (E-test) HELP & CONTACT Help center Contact Us Sign In / Register PCBGOGO SERVICES/PRODUCT PCB Instant Quote PCB Assembly service Advanced PCB Flex / Rigid-flex PCB Multilayer PCB COMMUNITY Feedback Forum Sitemap English | 日本語 Copyright © 2026 PCBgogo. All rights reserved.

QUICK CONTACT Please leave your message below and one of our helpful staff will contact you within 48 hours. Whatsapp： +8618665922549 Email: [email protected] Tel: +86 - (0) 755-2330-0601

Please leave your message below and one of our helpful staff will contact you within 48 hours.

Whatsapp： +8618665922549 Email: [email protected] Tel: +86 - (0) 755-2330-0601

CAPABILITIES PCBA Capabilities FR-4 PCB Capabilities Advanced PCB Capabilities Aluminum PCB Capabilities Copper PCB Capabilities Flexible PCB Capabilities Rigid-Flex PCB Capabilities ABOUT PCBGOGO Introduction Why Buy From us Order Guide Method of Payment Shipping Methods Guide News Privacy Policy Terms of Service OTHERS RoHS-lead Free PCBs Online Gerber View Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Quality guarantee Electric Test (E-test) HELP & CONTACT Help center Contact Us Sign In / Register PCBGOGO SERVICES/PRODUCT PCB Instant Quote PCB Assembly service Advanced PCB Flex / Rigid-flex PCB Multilayer PCB COMMUNITY Feedback Forum Sitemap

OTHERS RoHS-lead Free PCBs Online Gerber View Automated Optical Inspection (AOI) Automated X-ray inspection (AXI) Quality guarantee Electric Test (E-test) HELP & CONTACT Help center Contact Us Sign In / Register

PCBGOGO SERVICES/PRODUCT PCB Instant Quote PCB Assembly service Advanced PCB Flex / Rigid-flex PCB Multilayer PCB COMMUNITY Feedback Forum Sitemap

Ten Common problems in PCB Design

Recommended articles