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Master all process steps of the semiconductor back-end manufacturing - Part 1 - Taping, Grinding, Peeling, Testing
Updated on Sep, 2026
Teaching and Academics , Engineering, Electrical Engineering
Duration - 2.5 hours
Training 5 or more people ?
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Mastering Semiconductor Back-End Manufacturing: From Fundamentals to Advanced Techniques Join me in unlocking the secrets of semiconductor back-end manufacturing with this comprehensive course. Designed for beginners and professionals alike, this course dives deep into semiconductor fabrication, focusing on the critical back-end processes that transform silicon wafers into powerful, high-performance chips. What You Will Learn Core Principles Understand the foundational concepts of back-end semiconductor manufacturing. Advanced Techniques Explore up-to-date industry techniques and best practices. Process Integration Follow a step-by-step guide to wafer back-end manufacturing, from taping to final packaging. Quality Control Learn how high-quality and reliable chips are produced. Why Take This Course Expert Instruction Learn from an industry expert with real-world experience. Real-World Applications Gain practical knowledge based on current and emerging technologies. Engage in multimedia lectures, in-depth case studies, and hands-on projects. This course delivers the skills that you and your organization need today to succeed in the semiconductor industry. Whether you want to advance your career, break into the semiconductor field, or broaden your technical knowledge base, this course provides the tools and expertise needed to move forward. Enroll now and take your first steps toward becoming an expert in semiconductor manufacturing.
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My name is Tobias and I am working since 7+ years in the semiconductor industry, mainly focusing on the back-end wafer manufacturing process. After graduating from university with a M. Sc. degree in industrial engineering, focusing on electrical engineering and manufacturing, I entered the exciting and fast pacing cutting edge semiconductor industry and have not left since. My area of expertise involves the whole semiconductor manufacturing process with focus on the back-end manufacturing process steps like taping, grinding, peeling, testing, mounting, singulation and packaging.
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